Electronics product development
Custom enclosures and hardware for electronics
Develop robust hardware around your electronics, from first fit-check enclosure to finished low-volume units. Modulabs coordinates the mechanical specification and connects it to qualified machining, printing and sheet-metal suppliers.
Send the specification
Upload CAD, drawings, quantity and working requirements.
Order check
Engineers check material, process, inspection and supplier fit before production.
Confirmed quote
Receive the reviewed price by email, then continue to payment.
Typical applications
Parts your team can source
From early development to repeat low-volume demand, the manufacturing route is reviewed around the part’s actual duty.
- Machined aluminium enclosures
- Heatsinks and thermal spreaders
- Front panels and faceplates
- PCB mounts and card guides
- Sensor and camera housings
- EMC-conscious sheet-metal cases
Processes
A practical route for each stage
CNC enclosures
Rigid housings, sealing features, connector cut-outs and integrated thermal geometry.
View processSheet-metal cases
Cost-effective folded housings, rack panels, brackets and low-volume assemblies.
View processPrinted prototypes
Fast packaging, connector, access and assembly checks before production hardware.
View processMaterials
Materials selected for the working environment
Aluminium 6082 / 6061
Light, machinable and thermally conductive for housings and heatsinks.
Aluminium sheet
Lightweight folded enclosures and panels with finishing options.
Stainless or mild steel sheet
Rigid, durable cases where mass is less critical.
ABS, ASA and nylon
Practical prototype housings, clips and mounts selected for the working environment.
Design considerations
What to define before manufacture
Thermal path
Mark heat sources, interface pads and airflow constraints so contact faces and fin geometry can be reviewed.
Connector access
Include keep-out zones, cable bend space, fastener access and assembly sequence in the mechanical design.
Finish and marking
Define cosmetic faces, anodising or coating, conductive contact areas and any graphics as part of the specification.
Custom electronics enclosures